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Information × Registration Number 0122U002643, ( 0223U000126  ) R & D request Title Impact of metal deposited nanoparticles and the nanoparticle doped flux on solder joints between lead-free solders and metal substrates Head Plevachuk Yurii O., Доктор фізико-математичних наук Registration Date 27-05-2022 Organization Ivan Franko National University of Lviv popup.description1 The aim of the project is to improve the performance of materials for environmentally friendly lead-free solders based on Sn-Ag-Cu. The properties of soldered joints can be significantly improved by adding nanoscale metallic and non-metallic particles, which strengthen the solder matrix, reduce their brittleness and increase creep resistance. However, non-wetting nano-impurities (ceramic, carbon nanotubes) are often found to be expelled from a molten solder during a reflow process. The problem can be solved by forming a "bridge" between the nanoparticles and the solder matrix. Metal nanoparticles (such as Au, Cu and Ni) are considered ideal "bridge materials" because they are apt to react with Sn-based solder alloys to form IMCs during a soldering process. The influence of such a bridge on the matrix properties will be investigated. Carbon nanotubes and ceramics will be coated with Au, Cu, Ni nanoparticles using a conventional DC Diode Sputter Coater. The morphology and growth of intermetallic compounds between the solder and a Cu substrate under the influence of flux doped with metallic Cu, Ni, Co and bimetallic Ni-Sn nanoparticles will be studied. popup.nrat_date 2024-12-09 Close