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Information × Registration Number 0207U000073, 0106U008570 , R & D reports Title The supphire precision parts to optoelectronic devices bonding development popup.stage_title Head Ievgen Venger, Registration Date 05-01-2007 Organization Institute of Semiconductor Physics of NAS of Ukraine popup.description2 Solder bonding technology, chemical polishing technology and new nanopowder as epoxy-filling medium for sapphire parts joining has been developed. The joined sapphire parts have functioning capability under severe conditions (cryogenic temperatures, high temperature up to 1000?C). Flexing strength of polished parts was increased on 20-50%. Product Description popup.authors popup.nrat_date 2020-04-02 Close