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Information × Registration Number 0211U001385, 0109U000165 , R & D reports Title Development of processes of obtaining of new kinds of a bimetallic metal paper for radio electronic devices of space engineering popup.stage_title Head Trotsenko Vladislav Ivanovich, Registration Date 01-02-2011 Organization Dniepropetrovsk national university popup.description2 The object of study - new types of bimetallic foil with a thin working layer of copper for poluadditivnoytehnologii PCB production increased level of complexity and reliability of the PCB. The purpose of the work - to provide new types of bi-metallic foil for the production of precision printed circuit boards pluadditivnym method, increase density and reliability of printed circuit board to create small-sized electronic equipment. Methods of investigation - an optical and electron microscopy, profilometry, electrochemical measurements, metallography, methods of testing the basic materials of printed circuit boards. Physical and chemical bases of obtaining a bimetallic system of aluminum foil - copper for the production of precision printed circuit boards from heat resistant base materials, thermal polymerization conditions which require the creation of a bi-metallic foil barrier antidiffusion layer. The conditions for plasma deposition of aluminum-based conductive barrier film of nitrides of transition metals and plating of the working layer of copper sulfate electrolyte. Developed devices for the process of obtaining bimetallic foil in a continuous mode. Developed a method of processing the adhesive foil from a high-precision alloy of nickel - chromium and producer of film resistive element consisting of a flexible electric heating material on a thermally stable polymer-based technical purposes. The experimental samples of foil and successfully tested for compliance with their performance requirements specification. Ukraine received a patent for a process of foil for printed circuit boards. The results can be used to create the latest high-performance environmentally friendly technology of bi-metallic foil with the necessary properties for the production of precision printed circuit boards semi-additive method. Product Description popup.authors Кльонов Володимир Анатолійович Курбатова Ольга Лазарєвна Розмологов Валерій Леонідович Скородень Євгеній Павлович popup.nrat_date 2020-04-02 Close