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Information × Registration Number 0213U003880, 0111U004003 , R & D reports Title Development of Thermoelectric Coolers for High-Power Central Processor Units popup.stage_title Head Semenyuk Vladimir Alekseevich, Registration Date 05-02-2013 Organization Odessa National Academy of Food Technologies popup.description2 Microprocessors are the most common used devices in almost all modern electronic equipment. The increasing tendency of CPU frequency leads to increasing of its heat dissipation too. In this connection thermal management of the modern CPU becomes a vital issue. The goal of the first part of these researches devoted to the theoretical justification of the possibility to increase CPU power by integrating TEC into standards cooling system. Two possible ways of TEC integration is under consideration: option 1 with TEC located at the outside of the CPU's heat spreader and option 2 with the TEC integrated into the heat spreader being contacted directly with the die. The new method for TEC optimization is developed for both options. Intel Core i7-800 was chosen as an object for validation of proposed theoretical method. It was found that integration of optimized TEC allows to increase CPU power significantly. The second part of the researches connected with developing technology of TEC manufacturing process making and testing the samples. Experimental results approved theoretical expectation. It was defined that the use of thermoelectrics at standard thermal conditions (45° ambient) allows to increase CPU power on about 17-25 %. In cases of elevated ambient temperatures advantage of TE cooling is rising, and when ambient temperature is near equal the CPU controlled temperature thermoelectricity becomes the only way for CPU thermal management. Product Description popup.authors Дехтярук Р. І. Красільников М. І. Орлова Г. І. Орлюк О.В. Чере О.М. popup.nrat_date 2020-04-02 Close