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Information × Registration Number 0213U004826, 0113U004837 , R & D reports Title Reactive wetting at the solid-liquid interface by liquid alloy of the Au-Sn and Cu-Sn systems popup.stage_title Head Plevachuk Yu. O., Registration Date 27-12-2013 Organization Ivan Franko National University of Lviv popup.description2 The aim is to study alloys Cu-Sn, which can be used as lead-free solders in microelectronics and replace general used lead-based solders. These results contain the information about the basic structure-sensitive properties of new solders such as thermopower, electrical conductivity, viscosity, thermal conductivity, surface tension. Based on the results a simulations of the origin and dynamics of the surface in molten Cu-Sn during diffusion and convection is carrying out, using the phase-field method. Product Description popup.authors Королишин А.В. Мудрий С.І. Плевачук Ю.О. Склярчук В.М. Штаблавий І.І. popup.nrat_date 2020-04-02 Close