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Information × Registration Number 2106U000423, Article popup.category Стаття Title popup.author popup.publication 01-01-2006 popup.source_user Сумський державний університет popup.source http://essuir.sumdu.edu.ua/handle/123456789/583 popup.publisher WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim Description In this work it is experimentally investigated a size effect in temperature coefficient of resistance (TCR) of Ni films with Cu and Si02 thin overiayer. The parameters of electrical transfer (the mean-free path of electron, the reflectivity coefficient of the external surfaces, the reflection and transmission coefficients at the grain boundary) were calculations. Decreasing of the value of the reflectivity coefficient is due to the change of the surface microrelief. It is show that the value of TCR decreases caused by the conditions of scattering changes on internal and external boundaries. When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/583 popup.nrat_date 2025-05-12 Close