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Information × Registration Number 2114U000394, Article popup.category Стаття Title popup.author popup.publication 01-01-2014 popup.source_user Сумський державний університет popup.source http://essuir.sumdu.edu.ua/handle/123456789/35816 popup.publisher Sumy State University Description In this paper comparative analysis of MEMS (Micro-electro-mechanical System) based Micro-hotplate using three different heating elements use as separately are presented. Three different materials (viz. DilverP1, Polysilicon, and Platinum) are used as heating elements with same thickness of 0.2 m. Coventor- WareTM simulator has been used for construction of 3D model and electro-thermo-mechanical analysis of Micro-hotplate device. Power consumption, stress and displacement of Micro-hotplate are studied at operating temperature (165 ºC). It is obtained that power consumption, stress and displacement of Dilverp1 heating element are 13.06 mW, 190 MPa and 0.028 m which are less in comparison to those with Poly Silicon heater and Platinum heater at moderate temperature (150-200 C) over the sensing material (ZnO). When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/35816 popup.nrat_date 2025-03-24 Close