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Information × Registration Number 2115U002025, Article popup.category Thesis Title popup.author popup.publication 01-01-2015 popup.source_user Сумський державний університет popup.source http://essuir.sumdu.edu.ua/handle/123456789/40986 popup.publisher Sumy state university Description On the basis of thin films in microelectronics made the following elements of integrated circuits (IC): film resistors; electrodes (electrode film capacitors, spiral inductors busducts, installation guides, closures MIS  transistors) contact paths and platforms; auxiliary elements. Electrical connection of metals and semiconductors with metallic conductors is performed using layered condensation and formation of ohmic contacts not rectifier, the quality of which is largely dependent parameters and characteristics of microelectronic devices, their reliability and durability popup.nrat_date 2025-05-12 Close