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Information × Registration Number 2117U005441, Article popup.category Thesis Title popup.author popup.publication 01-01-2017 popup.source_user Сумський державний університет popup.source http://essuir.sumdu.edu.ua/handle/123456789/66532 popup.publisher Sumy State University Description Nowadays, we observe the transition for creation of the domestic and industry objects from the traditional methods involving the assembling of the different parts obtained by cutting, molding or otherwise to the additive manufacturing which refers to the object formation by using a layer-by-layer deposition of the versatile materials (metals, plastics, glasses, and so on) in the one 3D printing technological process. In the electronics, the attention should be given to the especially perspective technology, that is 3D ink printing of inks based on the metal nanoparticles (Ag, Cu, Sn) to obtain the printed circuit boards, charge-collecting contacts of thin-film solar cells and its connections with the external loads. Moreover, the inks based on the semiconductor materials (Cu2ZnSn(S,Se)4, ZnO) are the promising for the use in the sensitive elements of photoconverters, thermoelectric generators, transparent electronics, gas sensors, and touchpads. popup.nrat_date 2025-05-13 Close