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Information × Registration Number 0212U001464, 0111U004003 , R & D reports Title Development of Thermoelectric Coolers for High-Power Central Processor Units popup.stage_title Head Semenyuk Vladimir Alekseevich, Registration Date 06-02-2012 Organization The Odesse state acasemy of refrigeration popup.description2 Permanent increasing of transistors integration density in the die of central processor unit (CPU) leads to rising of its electrical power. In this connection, thermal management of modern CPUs becomes one of the most important problems. The goal of researches theoretical substantiation of possibility to increase the CPU power by TEC integration into the standard cooling system. Two possible ways of TEC integration is under consideration: option 1 with TEC located at the outside of the CPU's heat spreader and option 2 with the TEC integrated into the heat spreader being contacted directly with the die. The new method for TEC optimization is developed both options. Intel Core i7 - 800 Desktop Processor with 95 W heat dissipation was chosen as an object for validation of proposed theoretical method. It was defined that that the use of thermoelectrics for cooling CPU in standard thermal conditions allows to provide 17-25% increase in rocessor power. It was defined that option 1, with TEC location at the outer surface of heat spreader, is realizable in practice. Option 2, with TEC integrated into the heat spreader is problematic for practical realization, because the optimal heights of thermoelectric pellets for this option lay in the region form 60 to 70 mkm. The technology which could provide TEC manufacturing with such TE pellet heights does not exist nowadays. Product Description popup.authors Дехтярук Р.І. Красильников М.П. Попова Г.І. popup.nrat_date 2020-04-02 Close