Registration Number
0222U003019,
0120U102069
, R & D reports
Title
Non-destructive control, diagnostics and prediction of technical condition for electronic systems by acoustic emission method in military and non-military technical objects
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Head
Boiko Yulii M., Доктор технічних наук
Registration Date
17-02-2022
Organization
Khmelnytskyi National University
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Research object: sealed electronic packages in military and civil application.
The research goal: development of effective methods and appliances for non-destructive control, diagnostics and prediction of technical conditions of sealed electronic packages in military and civil application.
Research methods: electrotensometry; acoustic emission; methods for mechanical, pneumatic and thermal tests by static and cyclic forces.
Research instruments: tensometry measuring instrument 8ANC-26; acoustic emission instrument AF-15; tensile machine IR-5057-50; thermal chamber Foitron 3626/51.
Theoretical and practical results: the measuring system of electrotensometry and acoustic emission and test installation for strength and seal tests, non-destructive methods for strength and seal diagnostics and prediction of sealed electronic packages and system for warning of their depressurization have been designed.
Novelty of results: new methods and modification of measuring instruments and appliances have been designed for measurement and analysis of deformations in small-size structural parts and components in sealed electronic packages under static and cyclic mechanical, thermal and pneumatic impacts.
Implementation effect: the non-destructive strength and seal diagnostics and prediction methods for sealed electronic packages have been implemented in Company “Alpmontazh”, and enterprise “Novator”, c. Khmelnitsky. The economic effect of implementation is determined by the second stage of “Manufacturing implementation”.
Field of application: the performed complex of theoretical and experimental researches is oriented on the solution of important scientific and technical problem – improving reliability and durability of electronic packages by providing strength and seal of their structures.
Product Description
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Eremenko Oleksandr I.
Boiko Yulii M.
Voznyak Andriy G.
Goroshko Andriy Volodymyrovych
Kachuryk Ivan I.
Kovtun Igor I.
Lysenko Serhii Mykolaiovych
Moroz Victor A.
Petrashchuk Svitlana Anatoliivna
Royzman Vilen Petrovych
Cholovskyi Roman Genadiyovych
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2022-03-09
