1 documents found
Information × Registration Number 0223U005257, 0123U103953 , R & D reports Title Impact of metal deposited nanoparticles and the nanoparticle doped flux on solder joints between lead-free solders and metal substrates popup.stage_title Head Plevachuk Yurii O., Доктор фізико-математичних наук Registration Date 19-12-2023 Organization Ivan Franko National University of Lviv popup.description2  The object of the study is the effect of nanoscale metal and ceramic impurities and nanoscale carbon nanotubes and nanospheres on the structure-sensitive properties of metal near-eutectic alloys based on Sn‒Ag‒Cu. The subject of the research is the structure, microstructure and structure-sensitive properties of near-eutectic alloys based on basic matrix metal alloys Sn‒Ag‒Cu. The purpose of the research is to improve the characteristics of materials for environmentally safe lead-free solders based on Sn‒Ag‒Cu. The properties of soldered joints can be significantly improved by adding nano-sized metallic and non-metallic particles to the alloys, which strengthen the matrix of the solders, reduce their brittleness and increase resistance to creep. However, non-wettable nanoimpurities (ceramic, carbon nanotubes) are displaced from the melt during surfacing. The problem can be solved by forming a "bridge" between the nanoparticles and the solder matrix. Metal nanoparticles (such as Au, Au-Pd, Pt) are considered ideal "bridge materials" because they are able to react with Sn-based solder alloys to form intermetallic compounds during the soldering process. The effect of such a bridge on the properties of the matrix, as well as the morphology and growth behavior of intermetallic compounds between the Sn-based solder and the copper substrate was investigated. Research methods: X-ray spectroscopy (XRD), scanning electron microscopy (SEM), differential thermal analysis (DTA), transmission electron microscopy (TEM), tensile shear strength (Zwick/Roell Z 100). All physical quantities are given in the SI system. Product Description popup.authors Plevachuk Yuri O. Poverzhuk Viktor Olehovych Shtablavyi Ihor I. popup.nrat_date 2023-12-19 Close
R & D report
Head: Plevachuk Yurii O.. Impact of metal deposited nanoparticles and the nanoparticle doped flux on solder joints between lead-free solders and metal substrates. (popup.stage: ). Ivan Franko National University of Lviv. № 0223U005257
1 documents found

Updated: 2026-03-22