Registration Number
0223U005257,
(0123U103953)
, R & D reports
Title
Impact of metal deposited nanoparticles and the nanoparticle doped flux on solder joints between lead-free solders and metal
substrates
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Дослідження структурних параметрів твердих та рідких сплавів на основі Sn та мікроскопічний аналіз
Head
Plevachuk Yurii O., Доктор фізико-математичних наук
Registration Date
19-12-2023
Organization
Ivan Franko National University of Lviv
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The aim of the project is to improve the performance of materials for environmentally friendly lead-free solders based on Sn-Ag-
Cu. The properties of soldered joints can be significantly improved by adding nanoscale metallic and non-metallic particles,
which strengthen the solder matrix, reduce their brittleness and increase creep resistance. However, non-wetting nanoimpurities
(ceramic, carbon nanotubes) are often found to be expelled from a molten solder during a reflow process. The
problem can be solved by forming a "bridge" between the nanoparticles and the solder matrix. Metal nanoparticles (such as Au,
Cu and Ni) are considered ideal "bridge materials" because they are apt to react with Sn-based solder alloys to form IMCs during
a soldering process. The influence of such a bridge on the matrix properties will be investigated. Carbon nanotubes and
ceramics will be coated with Au, AuPd, Pt nanoparticles using a conventional DC Diode Sputter Coater. The morphology and
growth of intermetallic compounds between the solder and a Cu substrate will be studied.
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The object of the study is the effect of nanoscale metal and ceramic impurities and nanoscale carbon nanotubes and nanospheres on the structure-sensitive properties of metal near-eutectic alloys based on Sn‒Ag‒Cu. The subject of the research is the structure, microstructure and structure-sensitive properties of near-eutectic alloys based on basic matrix metal alloys Sn‒Ag‒Cu.
The purpose of the research is to improve the characteristics of materials for environmentally safe lead-free solders based on Sn‒Ag‒Cu. The properties of soldered joints can be significantly improved by adding nano-sized metallic and non-metallic particles to the alloys, which strengthen the matrix of the solders, reduce their brittleness and increase resistance to creep. However, non-wettable nanoimpurities (ceramic, carbon nanotubes) are displaced from the melt during surfacing. The problem can be solved by forming a "bridge" between the nanoparticles and the solder matrix. Metal nanoparticles (such as Au, Au-Pd, Pt) are considered ideal "bridge materials" because they are able to react with Sn-based solder alloys to form intermetallic compounds during the soldering process. The effect of such a bridge on the properties of the matrix, as well as the morphology and growth behavior of intermetallic compounds between the Sn-based solder and the copper substrate was investigated. Research methods: X-ray spectroscopy (XRD), scanning electron microscopy (SEM), differential thermal analysis (DTA), transmission electron microscopy (TEM), tensile shear strength (Zwick/Roell Z 100). All physical quantities are given in the SI system.
Product Description
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Shtablavyi Ihor I.
Plevachuk Yuri O.
Poverzhuk Viktor Olehovych
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2023-12-19
