Registration Number
0123U103953,
(
0223U005257
)
R & D request
Title
Impact of metal deposited nanoparticles and the nanoparticle doped flux on solder joints between lead-free solders and metal
substrates
Head
Plevachuk Yurii O., Доктор фізико-математичних наук
Registration Date
29-09-2023
Organization
Ivan Franko National University of Lviv
popup.description1
The aim of the project is to improve the performance of materials for environmentally friendly lead-free solders based on Sn-Ag-
Cu. The properties of soldered joints can be significantly improved by adding nanoscale metallic and non-metallic particles,
which strengthen the solder matrix, reduce their brittleness and increase creep resistance. However, non-wetting nanoimpurities
(ceramic, carbon nanotubes) are often found to be expelled from a molten solder during a reflow process. The
problem can be solved by forming a "bridge" between the nanoparticles and the solder matrix. Metal nanoparticles (such as Au,
Cu and Ni) are considered ideal "bridge materials" because they are apt to react with Sn-based solder alloys to form IMCs during
a soldering process. The influence of such a bridge on the matrix properties will be investigated. Carbon nanotubes and
ceramics will be coated with Au, AuPd, Pt nanoparticles using a conventional DC Diode Sputter Coater. The morphology and
growth of intermetallic compounds between the solder and a Cu substrate will be studied.
popup.nrat_date
2024-12-09
