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Information × Registration Number 2111U000533, Article popup.category Стаття Title popup.author popup.publication 01-01-2011 popup.source_user Сумський державний університет popup.source http://essuir.sumdu.edu.ua/handle/123456789/21998 popup.publisher Видавництво СумДУ Description The high dielectric constant (high-k) thin film of Al2O3 was deposited by using Plasma enhanced atomic layer deposition (PE-ALD) technique. The electron beam evaporation system was used to deposit the Pt-Ti metal to fabricate the Pt-Ti/Al2O3/Si MOS capacitors. Thickness measurement of Al2O3 gate dielectric was carried out with variable angle spectroscopic ellipsometry, which is measured to be 2.83 nm. The MOS capacitors were characterized to evaluate the electrical properties using capacitance voltage (C-V) analyzer at different measurement frequencies. Capacitance voltage measurement shows that, dielectric constant k ranges from 7.87 to 10.44. In CV curve a slight negative shift is observed in the flatband voltage because of presence of trap charges in the Al2O3 MOS capacitor. A lower equivalent oxide thickness (EOT) of 1.057 nm is obtained for the fabricated Pt-Ti/Al2O3/Si MOS capacitors. When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/21998 popup.nrat_date 2025-03-24 Close