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Information × Registration Number 0213U000279, 0111U002304 , R & D reports Title Providing strength and integrity of modules, sealed with compound, under thermal impacts popup.stage_title Head Royzman V. P., Доктор технічних наук Registration Date 29-01-2013 Organization Khmelnytskiy National University popup.description2 Object of research - electronic components sealed with compound and the compound. Project aim is providing strength of electronic components under thermal impacts by protecting them from the compound influence, and also strength and sealing of the compound inside micro-component unit, what is based on developing methods for calculation and measuring mechanical stress. Project results: mathematical stresses calculation model for the system of electronic component and compound under thermal impact is developed; the temperature distribution law in the volume of compounded micro-unit is defined; the non-stationary radial temperature distribution problem in the electronic component and compound inside the sealed-unit to calculate internal mechanical stress is solved; electric tensometry instruments are adapted and advanced to apply to measure stress in electronics components; the theoretically grounded calculative and experimental method is developed for identifying physical and mechanical characteristics of the researched materials; the effective technologies for protection of electronic components in sealed units are developed. Originality: it has first been developed the mathematical model for calculation of stress in electronic components having revolutionary shape and adjacent compound layer, which unlike the other models takes into account the total force of the stresses as from contact pressure, that appears in the bound of electronic component and compound, so for stress from irregular temperature distribution under thermal impact; the temperature distribution in the volume of compounded sealed micro-unit which is based on introducing "effective parameters" representing averaged physical and mechanical characteristics of all materials components of sealed unit is obtained; the non-stationary problem of heat conduction in electronic component sealed with compound assuming changing limit conditions of the system electronic component and compound is solved; the calculative and experimental method for identification of physical and mechanical characteristics of polymer materials within the frames of calculation model which describes stress and strain condition of the twolayer cylindrical structure "unknown material - test material" is developed; it has fist been identified physical and mechanical characteristics of compound and ceramics at negative temperatures down to -60 deg C. Product Description popup.authors Бабич Олег Петрович Бохонько Євген Олександрович Кокорєв Дмитро Олександрович Мороз Віктор Андрійович Петращук Світлана Анатоліївна Ройзман Вiлен Петрович Ткач Ігор Іванович popup.nrat_date 2020-04-02 Close