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Information × Registration Number 0219U005028, 0117U005248 , R & D reports Title Investigation of the interaction of an alloy based on Ni3Al with materials of layers of various alloying systems for TLP-diffusion welding and the effect of properties on the stress-strain state of compounds of a heat-resistant alloy during diffusion welding with activation of surfaces by a melt using computer simulations. popup.stage_title Head Kvasnitskiy Vjacheslav Fedorovich, Доктор технічних наук Registration Date 15-04-2019 Organization National university of Shipbuilding named after admiral Makarov popup.description2 The object of research is the formation of compounds of a heat-resistant alloy based on Ni3Al using nickel solder and the method of diffusion welding with a melting layer (TLP-compound). The aim of the work is to develop solder and TLP-process technology, which ensures the operation of joints at a temperature of 1100 ° C with a layer thickness of up to 0.08 mm and strength above 80% of the tensile strength of the base metal. To achieve the goal, a complex of preparatory and additional works was performed, ranging from the analysis of the literature, the development of research methods, which determine the necessary equipment, equipment, instruments, samples, and smelting in Ukraine of an analog of Chinese alloy IC10, since a dozen "finger" samples provided by the Customer are not enough to conduct such extensive research. Therefore, the technology of smelting an analogue of the ІС10 alloy, from the Contractor's materials, which is not considered in the report, was developed in advance. The report uses the results of the analysis of the literature, describes the methodology and results of research. Solders were studied using depressants: boron, silicon, zirconium and hafnium. The composition of solders was determined, the technological properties of solders (wetting, flowing into the gap), the structure, the chemical composition of the weld metal and the diffusion zone and the interaction of solders with the IC10 alloy or its analog, as well as the properties of the compounds were investigated. In this study, computer simulations have been carried out of the effect of intermediate solder interlayers on the stress-strain state of joints. Product Description popup.authors Б.В. Бугаенко В.В. Квасницкий Г.В. Ермолаев Е.А. Бутурля Л.М. Петренко М.В. Матвиенко С.И. Алексеева popup.nrat_date 2020-04-02 Close