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Information × Registration Number 0220U101443, 0117U001168 , R & D reports Title Developing scientific fundamentals in protection of electronic components installed on the main boards from their strain, and the boards from dynamic and thermal impacts popup.stage_title Head Boiko Yulii M., Доктор технічних наук Registration Date 11-02-2020 Organization Khmelnytskyi National University popup.description2 Research object: strain of the mainboards and electronic components mounted by through-hole and surface mount technologies. The research goal: development of effective methods and means for protecting contact joints and electronic components against the strain transmission from the mainboards and the mainboards from the external impacts. Research methods: electrotensometry; acoustic emission; vibrometry; high-speed video-shooting. Research instruments: tensometry measuring instrument 8ANC-26; acoustic emission instrument AF-15; acceleration measuring instrument PIU-1M; tensile machine IR-5057-50; thermal chamber Foitron 3626/51. Theoretical and practical results: research methods are developed to assess technological and operational impacts on the static strength of electronic components mounted on the mainboards; research methods are developed to assess dynamic strength of the printed circuit and the theory and practice for protection of printed circuit boards are developed. New knowledge is gained about the risks associated with strain transmission from the mainboard to electronic components and measures to protect these products against stress. The oscillations and collisions of mainboards in electronic packages were originally demonstrated, and also effective measures for vibration isolation are developed. The theory of oscillation of the mainboards, which are suspended on the fabric tape with the dry friction damper, was created. Implementation effect: the non-destructive strength diagnostics method has been implemented in Company “Alpmontazh”, c. Khmelnitsky. The economic effect of implementation is determined by the second stage of “Manufacturing implementation”. Field of application: the performed complex of theoretical and experimental researches is oriented on the solution of the important scientific and technical task – improving reliability and durability of electronic packages by providing strength for the mainboards and the components mounted thereon Product Description popup.authors Eremenko Aleksandr I. Bilyk Artem P. Boiko Yulii M. Voznyak Andriy G. Goroshko Andriy V. Drach Ilona V. Karpova Galina P. Karpova Lesya V. Kachuryk Ivan I. Kovalchuk Oleksandr V. Kovtun Igor I. Kochkin Sergiy V. Kurlovich Oleg V. Mishan Victor V. Martynyuk Valeriy V. Medsatiy Dmitro M. Moroz Victor A. Petrashchuk Svitlana A. Royzman Vilen P. Savenko Bogdan O. Tertichniy Roman A. Tkachuk Vitaliy P. popup.nrat_date 2020-04-02 Close