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Information × Registration Number 0222U004632, 0119U103552 , R & D reports Title Providing strength and hermetic seal of onboard electronic packages under pressure and temperature impacts popup.stage_title Head Boiko Yulii M., Доктор технічних наук Registration Date 22-09-2022 Organization Khmelnytskyi National University popup.description2  Research object: sealed electronic packages in onboard application. The research goal: development of methods for strength and air-tightness control, diagnostics and prediction of sealed electronic packages explored under external climatic impacts, such as external pressure and temperature drops. Research methods: electrotensometry; acoustic emission; methods for mechanical, pneumatic and thermal tests by static and cyclic forces. Research instruments: tensometry measuring instrument 8ANC-26; acoustic emission instrument AF-15; tensile machine IR-5057-50; thermal chamber Foitron 3626/51. Theoretical and practical results: the measuring system of electrotensometry and acoustic emission and test installation for strength and seal tests, non-destructive methods for strength and seal diagnostics and prediction of sealed electronic packages and system for warning of their depressurization have been designed. Novelty of results: new methods and modification of measuring instruments and appliances have been designed for measurement and analysis of deformations in small-size structural parts and components in sealed electronic packages under static and cyclic mechanical, thermal and pneumatic impacts. Implementation effect: the non-destructive strength and seal diagnostics and prediction methods for sealed electronic packages have been implemented in enterprise “Novator”, c. Khmelnitsky. The economic effect of implementation is determined by the second stage of “Manufacturing implementation”. Field of application: the performed complex of theoretical and experimental researches is oriented on the solution of important scientific and technical problem – improving reliability and durability of electronic packages by providing strength and seal of their structures. Product Description popup.authors Boiko Yulii M. Kovtun Igor I. Petrashchuk Svitlana Anatoliivna Royzman Vilen P. popup.nrat_date 2022-09-22 Close