1 documents found
Information × Registration Number 0223U000126, 0122U002643 , R & D reports Title Impact of metal deposited nanoparticles and the nanoparticle doped flux on solder joints between lead-free solders and metal substrates popup.stage_title Head Plevachuk Yurii O., Доктор фізико-математичних наук Registration Date 03-01-2023 Organization Ivan Franko National University of Lviv popup.description2  The object of the study is the effect of nano-sized impurities of Co, Ni and carbon nanotubes on the structure-sensitive properties of metallic binary and ternary near-eutectic alloys based on Sn. The subject of research is electrical conductivity, thermal conductivity, microstructure of near-eutectic alloys based on Sn, and microstructure of basic matrix metal alloys. The purpose of the research is to improve the characteristics of materials for environmentally safe lead-free solders based on Sn-Ag-Cu. The properties of soldered joints can be significantly improved by adding nano-sized metallic and non-metallic particles to the alloys, which strengthen the matrix of the solders, reduce their brittleness and increase resistance to creep. However, non-wettable nanoimpurities (ceramic, carbon nanotubes) are displaced from the melt during surfacing. The problem can be solved by forming a "bridge" between the nanoparticles and the solder matrix. Metal nanoparticles (such as Au, Cu, and Ni) are considered ideal "bridging materials" because they are able to react with Sn-based solder alloys to form intermetallic compounds during the soldering process. The effect of such a bridge on the properties of the matrix, as well as the morphology and growth behavior of intermetallic compounds between the Sn-based solder and the copper substrate was investigated. Research methods – contact 4-point method for measuring electrical conductivity; stationary method of coaxial cylinders for measuring thermal conductivity; X-ray spectroscopy (XRD) and scanning electron microscopy (SEM). All physical quantities are given in the SI system. Product Description popup.authors Dufanets Marta V. Prunitsa Vitalii V popup.nrat_date 2023-01-03 Close
R & D report
Head: Plevachuk Yurii O.. Impact of metal deposited nanoparticles and the nanoparticle doped flux on solder joints between lead-free solders and metal substrates. (popup.stage: ). Ivan Franko National University of Lviv. № 0223U000126
1 documents found

Updated: 2026-03-19