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Information × Registration Number 0304U001338, 0103U008548 , R & D reports Title Development construction of the flexible carrier and technology of the integrate circuit packaging. popup.stage_title Розробка конструкции гнучкого носія та технології складання інтегральної схеми. Head Grunyanska Valentyna, Registration Date 13-02-2004 Organization State Enterprise "Research Institute of Microdevices" STC "Institute for Single Crystals" of NAS of Ukraine popup.description2 The researchers have designed a integrate circuit of the 32-channel commutator on the flexible carrier made of varnished foil non-conductor (aluminum-polyimide) and described the process of its packaging. Both sides of the integrate circuit mounting zone have inputs/outputs with 1,0 mm step. The ultrasound bonding is used to bond the flexible carrier to the chip. The integrate circuit is soldered to standard boards.5635 Product Description popup.authors popup.nrat_date 2020-04-02 Close