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Інформація × Реєстраційний номер 2113U001386, Матеріали видань та локальних репозитаріїв Категорія Thesis Назва роботи Wetting Behavior of Molten Ag Nanodroplet on the Cu Substrate Автор Дата публікації 01-01-2013 Постачальник інформації Сумський державний університет Першоджерело http://essuir.sumdu.edu.ua/handle/123456789/35330 Видання Sumy State University Опис The main objective of this investigation was to study spreading of Silver (Ag) nanodroplet on the Cooper (Cu) surface by molecular dynamics (MD) simulation method. The quantum Sutton-Chen (Q-SC) many body potential was used to calculate cohesive energy as well as force experienced by every atoms. The temperature and pressure of nanodroplet were controlled by Nose-Hoover thermostat and Berendsen barostat respectively. The effect of nanodroplet size on the wetting and contact angle of silver nanodroplet on a copper solid surface was calculated by changing the number of atoms within the nanodroplet. By varying the cooling rate during spreading of nanodroplet, it was found that decreasing the cooling rate decreases the contact angle of nanodroplet, and it spreads better on the copper surface. Also, increasing initial temperature of nanodroplet decreased the contact angle. When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/35330 Додано в НРАТ 2025-05-12 Закрити